To obtain a maleimide resin composition having excellent molding processability without lowering heat and chemical resistances.
This maleimide resin composition comprises a maleimide copolymer composition having an aromatic vinylic monomer, a vinyl cyanide monomer, an N-substituted maleimide monomer and an unsaturated dicarboxylic acid anhydride monomer components within specific ranges. The composition has 0.5-0.8 value of a parameter k calculated by the formula 1 k=-[w1×ln(Tg/Tg1)]/[w2×ln(Tg/Tg2)] [wherein, Tg is the glass transition temperature (°C) of the maleimide resin composition; Tg1 is the glass transition temperature (°C) of an aromatic vinylic copolymer (B); Tg2 is the glass transition temperature (°C) of a maleimide copolymer (A); w1 is the compounding ratio (mass%) of the aromatic vinylic copolymer (B); and w2 is the compounding ratio (mass%) of the maleimide copolymer (A)].
OSHIMA KENJI
TAKAHASHI ATSUSHI
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