PURPOSE: To simplify manufacturing process by a method wherein a laminate obtained by laminating a multilayer film on a circuit substrate at reduced pressure is heat hardened at the atmospheric pressure.
CONSTITUTION: A multilayer film M consists of an insulating layer 4 and an additive layer 5. This insulating layer 4 is an organic layer having insulating capacity with respect to an inner layer circuit, which is made of a compound of epoxy resin and synthetic rubber. The additive layer 5 is an organic layer where a circuit is formed due to electroless plating, which is made of a blended material of a rubber component and a hardening resin component. The multilayer film M is laminated on a circuit substrate at reduced pressure. This provides a copper pattern 2 on the upper surface of an insulating substrate 1, the insulating layer 4 and the additive layer 5 are laminated, and a laminate T is heat-hardened at the atmospheric pressure. This simplifies manufacturing process.
YAMAZAKI HAJIME
WAKAMATSU HIROYUKI
TAKAHASHI HIROSHI
YOKOYAMA HIROYOSHI
HITACHI CHEMICAL CO LTD
HITACHI CONDENSER
| JPS62236726A | 1987-10-16 | |||
| JPS62236727A | 1987-10-16 | |||
| JPS54125284A | 1979-09-28 | |||
| JPS5512716A | 1980-01-29 | |||
| JPS60141873A | 1985-07-26 | |||
| JPS6323983A | 1988-02-01 |