PURPOSE: To easily form the base Ni plated layer as well as to prevent the occurence of cracks for the titled terminal by a method wherein electric Ni plating is performed on an outer metal ring and a lead wire having the linear expansion coefficient of 75× 10-7/°C or below at the temperature of 450°C or below, the lead wire is airtightly sealed in the outer metal ring through the intermediary of BSG, and then gold plating is performed.

CONSTITUTION: Electric Ni plated layers 9 and 10 of 8μm or thereabouts are formed on the whole surface of the outer ring 4 made of the alloy of 58% of FE and 42% of Ni, and the lead wire 6 of 53% of FE, 28% of Ni and 18% of Co, a lead wire 6 is airtightly sealed in the outer ring 4 through the intermediary of the BSG5, and gold plated layers 11 and 12 of 2μm in thickness are formed on the surface of the outer ring 4 and a lead wire 6. According to this method, the electric Ni plated layers 9 and 10 can be formed without generation of bending on the lead wire and the cracks on the glass by performing simplicial barrel plating on the outer ring 4 and the lead wire 6 before the sealing is performed. Also, even when a heat treatment is performed in the after process as in the case wherein chemical Ni plating is performed, cracks due to the increased hardness are not generated. This method is effective for the materials having the linear expansion coefficient of 75×10-7/°C or below at the temperature lower than 450°C.