Title:
MANUFACTURE OF AL-TA BASED ALLOY TARGET PLATE MATERIAL FOR SPUTTERING
Document Type and Number:
Japanese Patent JPH04182043
Kind Code:
A
Abstract:
PURPOSE: To reduce slitting, crack and segregation by using a vertical mold fitting a tapered heat radiation plate.
CONSTITUTION: In the mold for finishing a molten metal to an ingot-shape after vacuum-melting Al alloy containing Ta (0.5-10.0atm%), the vertical mold fitting the tapered heat radiation plate 3 is used. By this method, Al-Ta based sputtering target having less splitting, crack and segregation is obtd.
Inventors:
YAZAKI CHIKAO
Application Number:
JP31045690A
Publication Date:
June 29, 1992
Filing Date:
November 16, 1990
Export Citation:
Assignee:
SEIKO EPSON CORP
International Classes:
B22D21/04; B22D7/00; B22D7/06; C22C21/00; C23C14/34; (IPC1-7): B22D7/00; B22D7/06; B22D21/04; C22C21/00; C23C14/34
Attorney, Agent or Firm:
Kisaburo Suzuki (1 outside)
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