Title:
MANUFACTURE OF BOARD EQUIPPED WITH ELECTRONIC COMPONENT AND CRIMPING DEVICE
Document Type and Number:
Japanese Patent JP2000286538
Kind Code:
A
Abstract:
To provide a method for manufacturing a board equipped with electronic components and a crimping device, by which the electronic components can be surely crimped on the board.
When tape carrier packages(TCPs) 5 are crimped on TCP mounting regions of liquid crystal display panels 1 at a time, while pressure is applied with an elastic member 17 interposed. Accordingly, even if there are variations in height among the TCPs 5, the elastic member 17 on the TCPs 5 can absorb the variations and uniform pressure can be applied on the TCPs 5. In this way, the TCPs 5 can be surely crimped in batch on the TCP mounting regions of the liquid crystal display panels 1.
Inventors:
KOBAYASHI MASAYOSHI
Application Number:
JP9000699A
Publication Date:
October 13, 2000
Filing Date:
March 30, 1999
Export Citation:
Assignee:
SEIKO EPSON CORP
International Classes:
H01R11/01; G02F1/1345; G09F9/00; H05K1/14; H05K3/32; (IPC1-7): H05K3/32; G02F1/1345; G09F9/00; H01R11/01; H05K1/14
Attorney, Agent or Firm:
Kisaburo Suzuki (2 outside)