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Title:
MANUFACTURE OF BONDING AGENT ADHERING LAMINATED SHEET FOR ADDITIVE METHOD PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JPH05167222
Kind Code:
A
Abstract:

PURPOSE: To lessen the defective products generated by adhesion of foreign matters to the surface of a bonding agent when an additive method printed wiring board's bonding agent-adhering laminated sheet is processed.

CONSTITUTION: A metal-foil-coated adhesive applied laminated sheet is formed by sticking an adhesive sheet, obtained by applying an adhesive agent on a sheet of mold-releasing treated metal foil, to a laminated sheet. A hole is perforated in the metal-foil-coated laminated sheet, a circuit is formed, and then metal foil is peeled off.


Inventors:
ISHIGAMI FUMIO
KATO HIDEO
Application Number:
JP33535991A
Publication Date:
July 02, 1993
Filing Date:
December 19, 1991
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
B32B37/00; B32B7/12; B32B15/08; H05K1/03; H05K3/18; H05K3/38; (IPC1-7): B29D9/00; B32B7/12; B32B15/08; H05K1/03; H05K3/18; H05K3/38
Attorney, Agent or Firm:
Hirose Akira



 
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