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Title:
MANUFACTURE OF BORED DIAMOND GRINDSTONE
Document Type and Number:
Japanese Patent JPS6420974
Kind Code:
A
Abstract:

PURPOSE: To form fine holes on an edge section precisely and simply and remarkably improve the cutting performance of a diamond grindstone by binding the edge section to a substrate then boring this edge section with a discharge drilling machine.

CONSTITUTION: An edge section 2 mixed with diamond powder and metal alloy powder and sintered is bound to the outer periphery of a disk-shaped substrate 1 made of thin steel plate. Several sheets of the substrate 1 bound with this edge section 2 are stacked and mounted on the table 4 of a discharge drilling machine (superhigh-speed fine hole boring machine). Many fine holes 3 with the diameter of 1mm or less are bored with high precision on the edge section 2 of each substrate 1 by an electrode 5 under this condition. The cutting performance and durability of a diamond grindstone can be improved by forming fine holes 3 with the diameter of 1mm or less on the edge section 2.


Inventors:
MATSUDA YUSAKU
Application Number:
JP17544487A
Publication Date:
January 24, 1989
Filing Date:
July 14, 1987
Export Citation:
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Assignee:
SANWA DIAMOND KOGYO KK
International Classes:
B24D5/12; B24D5/00; (IPC1-7): B24D5/00; B24D5/12
Domestic Patent References:
JP59120557B
Attorney, Agent or Firm:
Zenkei Okada (3 outside)