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Patent Searching and Data


Title:
MANUFACTURE OF BUFFER PAD
Document Type and Number:
Japanese Patent JPH03147815
Kind Code:
A
Abstract:

PURPOSE: To make it possible to manufacture a buffer pad using only one foaming mold, avoiding thereby the additional use of a conventional trimming jig to remove flashes of a molded item by removing a needless part of the molded item through a cutting hole provided in a cavity of the foaming mold after molding the buffer pad.

CONSTITUTION: A cutting hole 12 for use in cutting and removing a needless part 1d of an instrument panel 1 is provided in a cavity 11 of a foaming mold 10, on the side of a skin 1a of said panel 1. A hot blade 15 adapted to be vertically movable along the inner side surface of the hole 12 of the cavity 11 is pressed by means of a drive means such as a hydraulic cylinder against the needless part 1d of the panel 1 to cut said part off. The skin 1a is set on the cavity 11 in which the cutting hole 12 is provided, while a core material 1b is set on a core 13 of the forming mold on which a blade receiving part 14 is provided so that polyurethane resin is injected into a space between the skin 1a and the core material 1b to effect foaming thereof, thereby a foam polyurethane body 1c is obtained.


Inventors:
KAKIGI TADASHI
Application Number:
JP28607789A
Publication Date:
June 24, 1991
Filing Date:
November 02, 1989
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
B29C39/30; B29K105/04; B29L31/58; (IPC1-7): B29C39/30; B29K105/04; B29L31/58
Attorney, Agent or Firm:
Hirose Akira