PURPOSE: To obtain a manufacturing method capable of producing a memory card simply at a moderate price by exposing connection terminals of an over film (reverse and front sides), core film and spacer film from respective corresponding openings so as to laminate them.

CONSTITUTION: A hot melt type adhesive 2 is coated to a film 1, and an over film is formed by laminating a protective film 3 for protecting the adhesive 2 thereon. Then a hole where a connection terminal 8 exposes, namely, an opening 7 is formed by dice. At this time the special attention is paid to the positioning of a pattern. The over film used for the reverse side of the card is formed in the same manner. A memory control circuit 11 and memory circuit 12 are connected to a print circuit having a circuit hole 10 where the memory control circuit 11 and memory circuit 12 enter, thereby forming a core film. Then a spacer film is made of materials having the same thickness as those of the core film. A hole where a printed circuit board 9 enters, that is, a core film hole 14, is drilled, and finally said respective films are laminated.