To provide a method for manufacturing a circuit board which can be subjected to an electrolytical plating process without any need of plating- exclusive lead wires tending to hinder operational characteristics of the circuit board, can be suitably used especially for processing high-speed or high-frequency signals, and can be excellent in strength and operational reliability.

A ceramic substrate 1 is formed thereon with a circuit layer and a plurality of conductor electrode parts 2, the plurality of conductor electrode parts 2 are mutually connected to form fine wire lines 3 to be later electrically short-circuited, and then the conductor electrode part 2 and a wiring layer are electrolytically plated using the fine wire lines 3. Thereafter, the substrate is subjected to a blast or etching process to remove the fine wire lines 3. It is preferable to form insulating grooves 5 between the adjacent conductor electrode parts 2, simultaneously with the removal of the fine wire lines 3 especially by the blast process.