Title:
MANUFACTURE OF CERAMIC LAMINATE
Document Type and Number:
Japanese Patent JP3236783
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To simultaneously bake internal conductors, each containing Au, Ag, Cu as the main components at a relatively low temperature by using ceramic raw material powder containing sintering aid for sintering ceramic particles at a specific temperature.
SOLUTION: A slip material, containing ceramic raw material powder which contains sintering aid for sintering ceramic particles at 850 to 1050°C and photosetting monomer, is manufactured. Then, a support board 33 is coated with the slip material, exposed, developed, formed with a through-hole 32, filling conductor paste in the hole 32, and formed with an internal conductor pattern 21, and these processes are repeated to manufacture a laminated molding which is a laminate of a plurality of insulating layer moldings. Then, a conductor film which is to become surface wirings is formed by printing and drying. After the board 33 has been removed, it is conducted via a binder removing step, and the molding is basked at 850 to 1050°C. Thus, the internal conductors, each containing Au, Ag and Cu as the main components can be baked simultaneously at a low temperature of 850 to 1050°C.
Inventors:
Akira Imoto
Yuzuru Matsumoto
Fukamizu Norimitsu
Yuzuru Matsumoto
Fukamizu Norimitsu
Application Number:
JP24314896A
Publication Date:
December 10, 2001
Filing Date:
September 13, 1996
Export Citation:
Assignee:
Kyocera Corporation
International Classes:
B32B18/00; B28B1/30; C04B35/46; H05K3/46; (IPC1-7): H05K3/46; B28B1/30; B32B18/00; C04B35/46
Domestic Patent References:
| JP715143A | ||||
| JP669374A | ||||
| JP63198398A |