PURPOSE: To fabricate chip resistors of the same shape by inserting projections into through holes from the front and rear surfaces by moving dies for positioning of a substrate having holes and chamfering of the edge of the front and rear surfaces of the through holes and by making slits on the front and rear surfaces by cutting the substrate with slit blades.
CONSTITUTION: An unbaked ceramic substrate 21 wherein through holes 5 are preliminarily made at the location of intersections of horizontal and vertical slits to be made by cutting the substrate is prepared. Then, dies 9 which have projected horizontal and vertical slit blades 6, 7 that has cone projections 8 at the intersections of the horizontal and vertical slit blades 6, 7 are prepared. Now, the dies 9 are placed up and down so as to face each other and the perforated substrate 21 is located between the facing dies 9 and then the dies 9 are moved up and down towards the substrate 21. By this movement of the dies 9, the projections 8 are inserted into the through holes 5 from the front and rear surfaces and the projections abut the through holes 5 and thereby the perforated substrate 21 is positioned. The upper and lower dies 9 are further pressed against the substrate 21 for forming with the projections 8 slant faces 51 at the outer edges of the front and rear surfaces of the through holes 5 and for making slits 3, 4 on the front and rear surfaces by cutting the substrates with the slit blades 6, 7. Then, the substrate is baked to make a ceramic substrate 2.
KANBE MAKOTO
USUDA JUICHI
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