Title:
MANUFACTURE OF CERAMIC TWO-SIDED WIRING SUBSTRATE
Document Type and Number:
Japanese Patent JPH01112794
Kind Code:
A
Abstract:
PURPOSE:To manufacture a ceramic two-sided wiring substrate having highly reliable through-holes by applying a resist which shows a higher resistance to etching on an etching resist of a through-hole land as well as on the etching resist at inside walls of a hole for use in the through-hole prior to etching. CONSTITUTION:Laser processing makes it possible to make holes for use in through-holes by using an alumina substrate and phosphorus makes the surface of an alumina sintering substrate as well as the inside well faces of the holes for use in the the through-holes rough uniformly and after cleaning and drying the surface of the foregoing substrate and holes, copper layers 6 are formed by plating them chemically and then, after polishing the move copper layers 6, a positive photoresist material 7 is coated on the copper layer by using a roll coating utensil. Then, the photoresist material becomes film like when it is exposed and developed to/with ultraviolet rays by using a positive mask pattern and after that, an etching resist 8 is screen-printed on an etching pattern of a through-hole land and toward the inside of the holes for use in the through- holes.
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Inventors:
WAKI KIYOTAKA
YAMAGUCHI NOBORU
YAMAGUCHI NOBORU
Application Number:
JP27113287A
Publication Date:
May 01, 1989
Filing Date:
October 27, 1987
Export Citation:
Assignee:
MATSUSHITA ELECTRIC WORKS LTD
International Classes:
H05K3/06; H05K3/00; H05K3/42; (IPC1-7): H05K3/06; H05K3/42
Attorney, Agent or Firm:
Takehiko Matsumoto