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Title:
MANUFACTURE OF CHIP CAPACITOR
Document Type and Number:
Japanese Patent JPH0456120
Kind Code:
A
Abstract:

PURPOSE: To simplify the process of producing a chip capacitor for enhancing its productivity by housing the main body 11 of the capacitor in a case and by applying electromagnetic heating to the main body 11 via electrically conductive elastic material 15 installed between an external electrode and a connecting terminal.

CONSTITUTION: In a case 13 forming connecting terminals 14 the main body 11 of a capacitor forming external electrodes 12 is housed. In the gap between the outer walls of electrodes 12 of the main body 11 and the outer walls of connecting terminals 14, electrically conductive elastic material 15 is installed. The elastic material 15 contains iron and nickel, and when the capacitor is heated by electromagnetic induction, the elastic materials 15 generate heat Sn-Pb on the surface of external electrodes 12 and that of connecting terminals 14 melts to electrically connect elastic material 15 with electrodes 12 and terminals 14. In the case 13, filling resin 16 is injected to seal the main body 11 of the capacitor.


Inventors:
WAKINO KIKUO
Application Number:
JP16339790A
Publication Date:
February 24, 1992
Filing Date:
June 21, 1990
Export Citation:
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Assignee:
MURATA MANUFACTURING CO
International Classes:
H05B6/02; H01G4/236; H01G4/30; H01G13/00; (IPC1-7): H01G1/153; H01G4/30; H01G13/00; H05B6/02



 
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