PURPOSE: To obtain a chip carrier which is superior in the reliability of mounting of an electronic part chip to a resin substrate by a method wherein a recessed place for mounting the electronic part chip is provided in the surface of the resin substrate and a metal foil with a bonding agent applied to its lower face is adhered on the bottom face of the recessed place.

CONSTITUTION: A recessed place 3 is provided in the surface of a resin substrate 1 and a circuit 9 is formed. Such a metal foil 5 as a copper foil is bonded on the bottom part of the recessed place 3 through a bonding agent 4 and the bottom face of the recessed place is coated with the metal foil 5. A bonding agent is applied to the surface of the metal foil 5 and an electronic part 2 is adhered on the metal foil 5. The chip 2 is connected with the circuit 9 by performing wire-bondings 10.