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Patent Searching and Data


Title:
MANUFACTURE OF CHIP FUSE ELEMENT
Document Type and Number:
Japanese Patent JPH1050191
Kind Code:
A
Abstract:

To provide a chip fuse element which can be electrically connected excellently and operates stably by producing terminal electrodes by successively forming a fuse conductor thin film and a glass film on a substrate, forming plating layers on exposed terminal parts, and then applying a conductive resin to the parts and curing the resin.

A glaze glass layer 11 is formed on the surface of a rectangular insulator substrate 1 made of, for example, an alumina ceramic. A fuse conductor thin film 3 of a metal thin film of such as Al is formed on the layer 11 into a prescribed pattern by photolithographic technique. After both ends of the film 3 are exposed, a low melting point glass film 5 is formed and further an overcoat resin coating 6 of epoxy type resin is formed on the film 5. The exposed both end parts 3a, 3b are treated with nitric acid, etc., and then plated with zinc by displacement plating. After that, overlaying terminal electrodes 2a, 2b and end face electrodes 4a, 4b are formed by applying a conductive resin produced by mixing Ag powder with an epoxy resin, curing the resin, and if necessary, plated with tin.


Inventors:
MORISHIGE KENICHIROU
OBA KOICHI
Application Number:
JP20081396A
Publication Date:
February 20, 1998
Filing Date:
July 30, 1996
Export Citation:
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Assignee:
KYOCERA CORP
International Classes:
H01H69/02; H01H85/00; H01H85/02; H01H85/045; H01H85/046; H01H85/06; H01H85/17; (IPC1-7): H01H69/02; H01H85/00