MANUFACTURE OF CHIP-TYPE PTC THERMISTOR

Japanese Patent JP3444240

B2

PROBLEM TO BE SOLVED: To provide a method for manufacturing a chip-type PTC thermistor for preventing an crack from being generated in a side face electrode formed by electrolytic plating, for uniformly forming a film formed by electrolytic plating even in a conductive polymer part on the inside face of an opening at the time of forming the side face electrode, and obtaining excellent connection reliability at the time of forming a protecting coat under the consideration of shortage due to soldering position deviation on a printed board.
SOLUTION: Materials to be formed at a temperature which is the fusing point of conductive polymer or less are used for the materials of a plating resist and protecting coat 25 in a process for forming the plating resist and protecting coat. Also, a treatment temperature in each process from a process for forming an opening 24 at an integrated sheet 23 to a process before a process for forming a side face electrode 26 by electrolytic plating on the sheet 23 on which the protecting coat 25 also used for plating resist is formed can be prevented from being made higher than the fusing point of the conductive polymer.

JPH07211501	DEVICE FOR FITTING THERMISTOR FOR TEMPERATURE DETECTOR FOR COOKING UNTENSIL
JPH0562804	OHMIC ELECTRODE MATERIAL AND SEMICONDUCTOR CERAMIC ELEMENT
JPH0258801	PLATINUM THERMISTOR AND ITS MANUFACTURE

Takashi Ikeda
Ikeuchi
Koichi Morimoto
Junji Kojima

JP19004099A

September 08, 2003

July 05, 1999

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Matsushita Electric Industrial Co., Ltd

H01C7/02; C04B35/64; (IPC1-7): H01C7/02; C04B35/64

JP9199302A
JP9115702A
JP9503097A

【文献】国際公開98/012715(WO,A1)

Fumio Iwahashi (2 others)

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