Title:
MANUFACTURE OF CHIP TYPE SEMICONDUCTOR
Document Type and Number:
Japanese Patent JP3604108
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To simplify the step of die-bonding a semiconductor chip to a substrate and omit the step of wire-bonding the die-bonded chip.
SOLUTION: The manufacturing method comprises steps of die-bonding a semiconductor wafer 11 to the top face of a first substrate 9 through a conductive adhesive 10, dicing the wafer 11 every chip 12 with leaving the substrate 9, die-bonding a second substrate 3 to the top face of the diced semiconductor wafer 11 through the conductive adhesive 10, filling a light-permeable resin 14 in the gap caused by the dicing between the semiconductor chips 12 to seal every semiconductor chip 12, and again dicing the resin sealed first substrate 9, semiconductor wafer 11 and second substrate 13 every the diced semiconductor chip 12 to obtain a chip type semiconductor 15.
Inventors:
Makoto Nagayama
Application Number:
JP3192497A
Publication Date:
December 22, 2004
Filing Date:
February 17, 1997
Export Citation:
Assignee:
Citizen Electronics Co., Ltd.
International Classes:
H01L21/301; H01L21/52; H01L31/0232; H01L33/26; H01L33/56; H01L33/62; (IPC1-7): H01L21/52; H01L21/301; H01L31/0232; H01L33/00
Domestic Patent References:
| JP5326618A | ||||
| JP58034951A | ||||
| JP7283439A | ||||
| JP10242533A | ||||
| JP10229220A |
Attorney, Agent or Firm:
Satoshi Asakawa