PURPOSE: To easily produce a small type chiplike solid electrolytic capacitor by a method wherein conductive substance is protrusively connected to the upper end part of the cathode conductive layer of a capacitor element, and the above-mentioned conductive substance is exposed to outside by providing resin sheathing using a transfer molding system.

CONSTITUTION: After a dielectric oxide film has been formed on the surface of a tantalum porous material on which a metal anode lead-wire 11 is provided, a capacitor element 13 is constituted by successively forming an electrolytic layer, a carbon layer and a cathode conductive layer 12, consisting of Pd coating material. Conductive substance 14 of Pd is laid thickly and connected to the upper end part of the above- mentioned cathode conductive layer 12 using thermoplastic polyester resin, for example, as a bonding agent. Subsequently, the anode lead-wire 11 is set in a metal mold in such a manner that it will be led out from one side, and resin cover 15 is provided using a transfer molding system. In this case, the conductive substance 14 is deformed by the heat and pressure of the mold, and it is exposed to outside. Then, a metal terminal layer 16 is formed on the tip part surface of the anode lead-wire 11, the exposed surface of the conductive substance 14, and the circumferential surface of both end parts of the resin cover 15.