Title:
MANUFACTURE OF CIRCUIT BOARD BY PLATING TRANSCRIPTION
Document Type and Number:
Japanese Patent JPH01278794
Kind Code:
A
Abstract:
PURPOSE: To enable the production of a large quantity of identical base die plates formed of identical metal to avoid environmental pollution by laminatedly forming a metal circuit by electric metal plating from the mother die plate of a circuit formed of a graphite layer and after that, transferring it in the surface of a base die plate. CONSTITUTION: A strong graphite layer CL is laminatedly formed in the surface of a die plate material T, and a negative type circuit is printed by a screen printing method in the surface of the graphite layer CL in an insulating ink IL to form a mother die plate TP having a graphite circuit. Next, a metal circuit MC is laminatedly formed by electric plating in the graphite circuit of the mother die plate TP, a thermohardening bonding layer Bn is laminatedly formed only in the surface of the metal circuit MC and the metal circuit MC of the base die plate P is made to abut on that of the mother die plate TP and those are heated and compressed, thereby transferring the metal circuit MC to the base die plate P by the mother die plate TP. Therefore, the mass production of the circuit base die plate having an identical standard and an identical quality can be achieved, environmental pollution due to the loss of a metal raw material and the use of chemicals can be avoided and besides the total cost can be reduced.
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Inventors:
TEI KOEN
Application Number:
JP18276588A
Publication Date:
November 09, 1989
Filing Date:
July 21, 1988
Export Citation:
Assignee:
TEI KOEN
International Classes:
H05K3/00; H05K3/20; H05K3/38; (IPC1-7): H05K3/20
Attorney, Agent or Firm:
Hironobu Onda
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