Title:
MANUFACTURE OF CIRCUIT BOARD DEVICE
Document Type and Number:
Japanese Patent JP3871095
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To enable connection at a low temperature by using a circuit connection material whose essential elements are radical polymerizing substance, compound which generates active radical by light irradiation, high polymer resin with film-formation ability and conductive particle.
SOLUTION: The film-like circuit connection material comprises radical polymerizing substance, adhesive element formed by mixing photo-setting element composed of compound which generates active radical by light irradiation with high polymer resin with film-formation ability and conductive particle. A first connection terminal and a second connection terminal are arranged in opposition and the film-like circuit connection material is interposed therebetween, and a first connection terminal and a second connection terminal arranged in opposition are electrically connected by heat pressurization and optical irradiation. Thereby, a temperature required for connection can be lowered. Thereby, good adhesion strength and good electrical conduction can be obtained and a highly reliable circuit board device can be obtained.
Inventors:
Toshiyuki Yanagawa
Yasushi Goto
Izuo Watanabe
Yasushi Goto
Izuo Watanabe
Application Number:
JP8517098A
Publication Date:
January 24, 2007
Filing Date:
March 31, 1998
Export Citation:
Assignee:
Hitachi Chemical Co., Ltd.
International Classes:
H01L21/60; C08F2/50; C09J4/00; (IPC1-7): H01L21/60; //C08F2/50; C09J4/00
Domestic Patent References:
| JP8325543A | ||||
| JP6163633A | ||||
| JP10338844A | ||||
| JP11195325A | ||||
| JP10338842A | ||||
| JP10338841A | ||||
| JP10273540A |