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Patent Searching and Data


Title:
MANUFACTURE OF CIRCUIT BOARD
Document Type and Number:
Japanese Patent JPH02164093
Kind Code:
A
Abstract:

PURPOSE: To reduce manufacture time and to improve dimensional accuracy and yield by forming a pattern by printing paste on an insulating ceramic board, by acquiring a conductive circuit pattern by burning it through a heat source for flame-spraying and by forming an insulating layer by flame-spraying an insulating material.

CONSTITUTION: Paste 2 is screen-printed on a sintered alumina ceramic board 1 to form a pattern. Then, the paste 2 is burned inside a chamber 6 which is regulated to argon atmosphere through plasma get 3 to acquire a conductive circuit pattern. Mixed powder 4 is transferred into the plasma jet 3 to acquire a flame spray coating 5. Since no organic binder is included in the board 1, there is no possibility that the board 1 develops warp, waviness or dimensional variation. Manufacture time can be thereby reduced, thus improving dimensional accuracy and yield.


Inventors:
MIFUKU HIDEFUMI
TAKADA MITSUYUKI
MORIHIRO YOSHIYUKI
TAKASAGO HAYATO
Application Number:
JP31999788A
Publication Date:
June 25, 1990
Filing Date:
December 19, 1988
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
H05K3/12; H05K3/28; (IPC1-7): H05K3/12; H05K3/28
Attorney, Agent or Firm:
Masuo Oiwa (2 outside)