Title:
MANUFACTURE OF CIRCUIT PROTECTIVE DEVICE
Document Type and Number:
Japanese Patent JP3020843
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To improve physical and electric features by directly bringing a conductive polymer into contact with a metal electrode having a microrough surface.
SOLUTION: High density polyethylene, carbon black, titan oxide, and oxidation preventing agent are mixed by a banbury mixer, and pellet obtained by dissolution and extrusion in a water bath is dried and extruded to a sheet, and a sample is cut. Each sample is laminated between two metallic foils by using a heating press. An electrode is provided with a microrough surface, and directly and brought into physical contact with a layer-shaped conductive polymer element, and constituted of projecting and recessing parts projecting from the surface with 0.1-100 μm and having at least one dimension parallel to the surface below 500 μm. The metallic foil is an electrodeposited copper foil obtained by turning a surface adjacent to the sample into a passivated state by nickel and zinc. Afterwards, a disc-shaped device is punched from this laminated object, a nickel plated steel lead line is attached, and a device is sealed with epoxy resin, and the epoxy resin is cured.
Inventors:
Rosa Kleiner
Martin Matthisen
Martin Matthisen
Application Number:
JP23000495A
Publication Date:
March 15, 2000
Filing Date:
September 07, 1995
Export Citation:
Assignee:
RAYCHEM CORPORATION
International Classes:
B01D35/06; B32B7/10; H01B5/16; H05B3/03; H01C1/14; H01C7/02; H01L51/05; H02H5/04; H05B3/10; H05B3/14; F02B3/06; (IPC1-7): H01F7/02; H05B3/03; H05B3/14
Domestic Patent References:
| JP60196901A | ||||
| JP6031548A | ||||
| JP56160004A | ||||
| JP56160005A | ||||
| JP5834901A | ||||
| JP6298601A |
Attorney, Agent or Firm:
Aoyama Ryo (1 person outside)