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Title:
MANUFACTURE OF COMPOUND WIRE ROD
Document Type and Number:
Japanese Patent JPS5930419
Kind Code:
A
Abstract:

PURPOSE: To manufacture a compound wire rod with a thick coating by a samll-sized device including small-thick size without spoiling the linearity of a core material by coating the core material with an alloy covering material which has a lower fusion point than it by extrusion in a half-fused state.

CONSTITUTION: Alloy 7 as a covering material is put in the container 1 of an extruder and heated by a heater 3 into a half-fused, i.e. solid-liquid mixed state, and is made to uniform by a stirring device 9 when necessary. On the other hand, while the core material is inserted from a hollow mandrel 5, pressure is applied to a ram 2 and the compound wire rod 8 is extruded from an extruding die 4. Tensile force is applied from in front of the core material 6 during the extrusion to increase the speed of the extrusion. Said alloy 7 has such composition that eutectic reaction is caused at temperature lower than the fusion point of Al by adding ≥1 kind of elements among Si, Sn, Mg, Zn, Cu, Ga, and Ge to Al, and fine solid-liquid mixture is obtained preferably. The core material 6 uses a material such as iron having a higher fusion point than the alloy 7.


Inventors:
SAWADA KAZUO
MIYAZAKI TAKESHI
Application Number:
JP14143282A
Publication Date:
February 18, 1984
Filing Date:
August 14, 1982
Export Citation:
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Assignee:
SUMITOMO ELECTRIC INDUSTRIES
International Classes:
B21C23/28; B21C23/24; (IPC1-7): B21C23/22
Domestic Patent References:
JP39007156A
JP45025366A
JPS5129093A1976-03-11
JPS558348A1980-01-21
JPS4732911A
Attorney, Agent or Firm:
Hideki Aoki