Title:
MANUFACTURE OF CONDUCTIVE CIRCUIT
Document Type and Number:
Japanese Patent JP3196676
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide the wiring method of a conductive circuit, which is capable of designing a wiring pattern easily without degrading mass-production performance in the conductive circuit formed by a covered conductor.
SOLUTION: A covered conductor 7 is sequentially wired to the first and second wiring patterns 24, 26 formed into a wiring metal pattern 14 by a wiring machine as the first and second wiring conductors 34, 35. The unnecessary parts 34a, 35a of respective wiring conductors 34, 35 are cut off for removal. The second wiring conductor 35 is transferred to a wiring plate 31a, and at the same time, the first wiring conductor 34 is transferred to a wiring plate 31b. The covered conductor 7 is wired to the respective wiring patterns 24, 26 again, and the unnecessary parts 34a, 35a are cut off for removal. The wiring plate 31a is removed, the second wiring conductor 35 is transferred to the wiring plate 31b, and at the same time, the first wiring conductor 34 is transferred to the wiring plate 31c.
Inventors:
Kenichiro Nakanishi
Application Number:
JP527397A
Publication Date:
August 06, 2001
Filing Date:
January 16, 1997
Export Citation:
Assignee:
SUMITOMO WIRING SYSTEMS,LTD.
International Classes:
H01R43/00; H02G3/16; (IPC1-7): H02G3/16; H01R43/00
Domestic Patent References:
| JP4172908A | ||||
| JP5260629A | ||||
| JP965546A |
Attorney, Agent or Firm:
Hironobu Onda