Title:
MANUFACTURE OF CONDUCTIVE POWDER AND CONDUCTIVE PASTE AND ELECTRONIC COMPONENT USING THEM
Document Type and Number:
Japanese Patent JP2000285733
Kind Code:
A
Abstract:
To provide a high reliability conductive paste used for forming an electrode of an electronic component and provide a manufacturing method of the conductive powder used for the conductive paste.
A conductive metal is reduction-deposited on the surface of glass frit by using glass frits, a metal salt aqueous solution and a reducing agent, the glass frit surface is covered with the conductive metal to manufacture conductive powder, and a conductive paste kneaded with the conductive powder, a binder and a solvent is applied and baked on an electronic component element to form an electrode.
Inventors:
KANAZAWA ATSUSHI
Application Number:
JP9257399A
Publication Date:
October 13, 2000
Filing Date:
March 31, 1999
Export Citation:
Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
H01C7/10; C03C8/18; H01B1/00; H01B1/22; H01B13/00; H05K1/09; H01M4/62; (IPC1-7): H01B1/22; C03C8/18; H01B1/00; H01B13/00; H01C7/10
Attorney, Agent or Firm:
Fumio Iwahashi (2 others)
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