PURPOSE: To enable molding to be performed even in use of liquid resin, and achieve heat- resistance, mechanical strength or the like, and also obtain excellent conductivity against secular deterioration by molding a primary molded item of a conductive resin composite and then removing the thermoplastic resin component by elution so as to obtain a conductive net consisting of conductive fiber and lower melting point metal, and then performing a secondary molding thereto in use of other resin.

CONSTITUTION: A conductive resin molded item is composed of copper fiber as conductive fiber, solder as low melting point metal, and polystylene resin having a small quantity of heavy metal deactivator added thereto. A primary molded item 1 is obtained by performing injection molding at a temperature of 230°C, higher than 183°C of solder melting point. A conductive resin layer 2 is formed on the surface, and on the inner part thereof is formed a knitted conductive net 3 consisting of conductive fiber and low melting point metal, and further a metal terminal 4 is attached to the outer periphery, followed by insertion molding. The primary molded item is immersed in methylene chloride so as to remove resin component by elution and thus obtain a knitted conductive net. This is then mounted on a mold, and epoxy resin with heat-resistance and mechanical strength is poured into the mold, and thereafter a composite secondary molded item 6 is obtained after a vacuum-defoaming and following heat-curing process.