To readily make compatible the dimensional accuracy of a semiconductor light-receiving element mounting surface and the heat dissipating property of a container for a semiconductor light-receiving element housing.

This manufacturing method, wherein a resin frame body which has almost the same external size as that of a rectangular-shape ceramic board 1, encircles a mounting surface 1a and at the same time, pinches a plurality of lead frames 3 on the sides of the long sides thereof, has a prescribed difference between thermal expansion coefficients and has a prescribed thickness, is bonded to the ceramic board 1, which has warpage of a prescribed accuracy in a prescribed thickness and has a mounting surface 1a on the upper surface thereof, with a bonding agent 4 consisting of an epoxy resin containing a prescribed amount of an acrylic rubber to obtain a container for semiconductor light-receiving element housing having the mounting surface 1a of planarity which is formed into a recessed form of 30 μm or smaller, in the long side direction thereof. A container for semiconductor light-receiving element housing, which has high dimensional accuracy of the mounting surface 1a and is high in reliability and also superior in heat dissipating properties can be manufactured.