PURPOSE: To enable mass production, by pinching a mount body wherein electrode surfaces on both surfaces of a semiconductor element are sandwiched between a pair of flat electrode plates serving as heat sinks by a mold retainer and exfoliating the retainer after molding.
CONSTITUTION: A mount body 17 wherein both electrodes 12a, 12b of the diode element 12 are junction-fixed in a sandwich form between a pair of flat plate electrodes 13, 14 serving as heat sinks is tightly fixed in a plurality with clearances between mold retainers 18, 21. The clearances between the retainers 18, 21 are filled with a molded resin member 16 resulting in an integral body. The mold reatiners 18, 21 are exfoliated and cut-separated for every element. Thus, a mounting on a printed substrate or the handling is facilitated resulting in mass production.
TOMITA YUUJI
FUJITA SHIGESHIZU
KUMANO SHIYOUJI
