PURPOSE: To effectively connect a lead terminal to a substrate by forming the end of the terminal in a bifurcated state, bending the bifurcated section to hold the substrate therebetween, and then raising by plastic deformation a part of the bifurcated section at the base end.

CONSTITUTION: The end of a lead terminal 1 is formed in a bifurcated state, the bifurcated section 5 is bent to hold a substrate 6 therebetween, and the part of the section 5 at the base end is raised by plastic deformation. Accordingly, after the section 5 is bent, it can prevent a spring tending to return to the original state from returning thereto. Thus, the section 5 is not levitated from the substrate 6 to effectively connect the terminal 1 to the substrate 6, to simultaneously rigidly support the substrate by the terminal 1, thereby obtaining a DIP electronic component having high reliability.