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Title:
MANUFACTURE OF ELECTRODE FOR CHIP TYPE SOLID ELECTROLYTIC CAPACITOR
Document Type and Number:
Japanese Patent JPH05299309
Kind Code:
A
Abstract:

PURPOSE: To improve productivity and eliminate the decrease or the iregularity of electrostatic capacity, by a method wherein, after an aluminum electrode plate is etched, or after further an anode oxide film layer is formed, the electrode plate is cut by using a high density energy heat source.

CONSTITUTION: A foil formed by caldding Al alloy foils manufactured by a quench solidification method on both sides of an aluminum foil is subjected to etching treatment and formation treatment to form a capacitor electrode plate 1, the surface and the rear of which are composed of etching.formation layer 2 and the intermediate layer of which is composed of a pure metal (Al) layer 3. The capacitor electrode plate 1 is cut by casting a laser beam 6 from the electrode element surface. Thereby cutting is enabled without applying mechanical load to the electrode material of a belt type or a large plate subjected to etching and formation treatment, and a cut part where etching structure is not broken down can be obtained.


Inventors:
IWAMI HIROSHI
ENDO MICHIO
Application Number:
JP7799492A
Publication Date:
November 12, 1993
Filing Date:
March 31, 1992
Export Citation:
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Assignee:
NIPPON STEEL CORP
International Classes:
B23K26/38; H01G9/00; H01G9/04; H01G9/048; H01G9/052; H01G9/055; H01G9/15; B23K101/40; (IPC1-7): H01G9/05; B23K26/00; H01G9/04; H01G9/24
Attorney, Agent or Firm:
Hiroaki Tamura (1 outside)