Title:
MANUFACTURE OF ELECTRODE AND SUBSTRATE WITH ELECTRODE
Document Type and Number:
Japanese Patent JPH1115406
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide an electrode excellent in positional precision by burying electrode material in a part where a relief pattern is not formed and removing the relief pattern after heating. SOLUTION: As the electrode material, the composition consisting essentially of organic component such as high polymer binder, metal such as copper, silver, gold, metal oxide or alloy and containing additive as need is used. Since it is desired that the relief pattern is not eroded with the electrode material, the relief pattern of a photosensitive resin layer after developing is dewatered, dried, and then exposed or heated. The relief pattern is easily removed by removing the needlessly stuck electrode material beforehand. When the relief pattern is peeled by removing solution, e.g. organic solution, hot water, 1-10% wt.% solution of sodium hydroxide or potassium hydroxide is used. Needless components are vaporized from the electrode, and the electrode is heated and burned at 300-550 deg.C for 5-60 minutes for improving conductivity and mechanical characteristic. Thus, the substrate with the electrode is obtained.
Inventors:
FUJIEDA TADAYASU
SUDO TETSUYA
MUKAI IKUO
SUDO TETSUYA
MUKAI IKUO
Application Number:
JP17029997A
Publication Date:
January 22, 1999
Filing Date:
June 26, 1997
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
H01J9/02; G09F9/30; H01J9/14; H05K3/00; (IPC1-7): G09F9/30; H01J9/02; H01J9/14; H05K3/00
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