MANUFACTURE OF ELECTROMAGNETIC WAVE SHIELDING PLATE AND THE ELECTROMAGNETIC WAVE SHIELDING PLATE

Japanese Patent JP3935596

B2

PROBLEM TO BE SOLVED: To provide a manufacturing method of an electromagnetic wave shielding plate which is provided with a mesh formed from a metal thin film that can cope with such aspects as quality and productivity.
SOLUTION: This manufacturing method of an electromagnetic wave shielding plate that is used by installing it in front of a display and has an electromagnetic wave shielding property and transparency, by forming a conductive substance into a predetermined shape on one or both of the surfaces of a transparent board. In this case, this method comprises sequentially (a) a recessed part forming process to form recessed parts having a predetermined shape on one or both of the surfaces of the transparent board, (b) a conductive thin film forming process to form, on the recessed part formation side surface of the transparent board including the recessed part formation surface, and a conductive thin film on which metal can be electrodeposited, (c) a paste filling process to fill an etching-resistance resin paste only in the recessed parts, (d) an etching process to remove the conductive thin film in only a region exposed from the etching-resistance resin paste through etching, (e) a paste removing process to remove the etching-resistant resin paste remaining in the recessed parts, and an electrodepositing process to form a conductive metal on the conductive thin film by means of electropositing, after the paste removing process.

Takeuchi Satoshi

JP8049398A

June 27, 2007

March 13, 1998

Click for automatic bibliography generation  

Dai Nippon Printing Co.,Ltd.

H05K9/00; G09F9/00; G12B17/02; H01J11/44; (IPC1-7): H01J11/02; G12B17/02; H05K9/00

JP10041682A
JP10051183A
JP9186486A
JP4118831A

Satoshi Kanayama

Previous Patent: BRACE DAMPER

Next Patent: ELECTROLYTIC CAPACITOR