PURPOSE: To prevent short-circuit defect from being generated because of falling off of metallic powder by providing processes such as manufacture of a cap of an electronic component package through the application of press forming to a metallic plate, nickel plating to the said cap and heat treatment of the cap at 700∼1,200°C.

CONSTITUTION: The cap 3 is manufactured by applying drawing press processing and press punching processing to an iron or a low carbon steel plate having a thickness of nearly 0.2mm. Then an electric nickel plating layer 14 having a thickness of 2∼8μm is formed on the entire face of the cap 3 and the metallic powder 13 is coated. Then heat treatment is applied to the said cap 3 under weak reducing atmosphere at 700∼1,200°C and the metallic powder 13 is fixed strongly. Moreover, a chemical plating nickel plating layer 15 having a thickness of 2∼8μm is formed to the entire face of the cap 3. Then the metallic powder 13 fixed by the electric nickel plating layer 14 is fixed more strongly by the chemical nickel plating layer 15 and the weldability is improved in welding the cap 3 to the stem 2.