MANUFACTURE OF ELECTRONIC COMPONENT

Japanese Patent JP3223298

B2

PROBLEM TO BE SOLVED: To enable manufacturing with high productivity electronic components having excellent quality and high performance, by keeping the inside of an airtight casing at specified vacuum while a squeezee for forcibly supplying a liquid-like sealing resin into a through-hole section of a stencil moves in a forward stroke, and temporarily returning the inside of the airtight casing from the specified vacuum to the normal pressure at the time of changing from a forward stroke to a return stroke.
SOLUTION: While the inside of an airtight casing 1 is kept at specified vacuum, a squeezee 11b for a forward stroke the rear side is descended to contact on the surface of a stencil 8 with reference to the forward direction, and the predetermined amount of liquid-like sealing resin 15 is supplied to the front side thereof. Thereafter, the resin 15 is forcibly supplied into a through-hole section 8a of the stencil 8 by operating the squeezee 11 as a moving body 10 moves in a forward stroke. The resin is forcibly supplied in a return stroke according to the following steps. With the inside of the airtight casing 1 kept vacuum, a lift 7 is descended, then a releasing operation from the stencil 8 is carried out, and a table 6 is returned onto a rolling device 4 simultaneously. Thereafter, the inside of the casing 1 is returned to normal pressure by ascending the upper casing 1A, and a transfer port 2 is opened at the same time.

Atsushi Okuno
Koichirō Nagai
Noriko Fujita
Yuki Ishikawa
Noritaka Ohyama
Hashimoto Tsuneichi

JP32468498A

October 29, 2001

November 16, 1998

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Sanyu Rec Co., Ltd.

B41F15/08; B41F15/12; B41F33/00; H01L21/56; (IPC1-7): H01L21/56

JP5114620A
JP55141733A
JP58207643A
JP1140590A
JP1140591A

Eiji Saegusa (10 others)

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