MANUFACTURE OF ELECTRONIC PART

Title:

MANUFACTURE OF ELECTRONIC PART

Document Type and Number:

Japanese Patent JP2713510

Kind Code:

B

Abstract:

PURPOSE: To provide a method of manufacturing an electronic part using a lead frame, where number of defectives produced at the forming process or the cutoff of the lead terminals of the electronic part contained in the electronic parts judged as non-defective by a performance test is lessened.
CONSTITUTION: After the molded part 9 of an electronic part is molded, a film member 11 is pasted on a lead frame 1 spreading over both the film member 11 and the molded parts 9, lead terminals 5 and 6 are cut off from the lead frame 1 and then subjected to a forming process, and then a semiconductor chip is tested in a performance test.

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Inventors:

Uesugi, Kenji

Application Number:

JP1991000162986

Publication Date:

October 31, 1997

Filing Date:

July 03, 1991

Export Citation:

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Assignee:

ROHM CO LTD

International Classes:

H01L21/56; H01L23/50; (IPC1-7): H01L21/56; H01L23/50

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