PURPOSE: To improve reliability of a conductive passage formed in a through hole by laminating prepreg obtained by impregnating a base material with epoxy resin, molding it by heating under pressure, and then heating it at a temperature of a specific range under no pressure.

CONSTITUTION: A method for manufacturing an epoxy resin laminated plate to be used for a printed circuit board having a conductive passage in a through hole comprises the steps of laminating several prepregs obtained by impregnating base materials made of glass woven fabric, nonwoven fabric, mat, etc., with epoxy resin and semicuring it, superposing, as required, a copper foil, etc., holding them at molding plates, and heating it under pressure. After the molding, it is heated under no pressure, wherein a heating temperature is 100°C or higher and higher by 30°C than a glass transition temperature of the laminated plate. A time required for the heating is desirably a range of 10-180min.