Title:
セラミック電子部品の製造方法、セラミック電子部品およびセラミック電子部品の製造装置
Document Type and Number:
Japanese Patent JP4513530
Kind Code:
B2
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Inventors:
Hidekazu Kurihara
Miyoshi Kotoku
Miyoshi Kotoku
Application Number:
JP2004342885A
Publication Date:
July 28, 2010
Filing Date:
November 26, 2004
Export Citation:
Assignee:
MURATA MANUFACTURING CO.,LTD.
International Classes:
H01P11/00; B23K26/351; B23K26/361; C23F4/04; H01P7/04; B23K101/40
Domestic Patent References:
| JP2003502893A | ||||
| JP4185103A | ||||
| JP8037410A | ||||
| JP6350314A |
Attorney, Agent or Firm:
Hitoshi Nishizawa