PURPOSE: To obtain a high quality face plate structure, by making a through-hole having the diameter larger than a signal take-out electrode at the predetermined position of a plate then inserting an electrode through said hole and covering the circumference of said through hole with a mask thereafter adhering them with a chip provided at the tip with a low melting point metal and heated with high temperature.

CONSTITUTION: A through-hole 1a having the diameter larger than that of a signal take-out electrode 2 is formed at a part of the outer-circumferential section except the effective face (A) of a face plate 1, then an electrode 2 is inserted through said hole 1a and held temporarily while a heated chip 7 is arranged above said hole 1a and a glass solder is mounted at the tip section. After arranging a mask 8 such as Teflon which encloses said hole 1a and shields the effective face (A) said chip is lowered, and the glass solder 3 is filled between the gap (G) while applying the supersonic wave thus to adhere said electrode 2 to said hole 1a. Consequently the adhesion strength can be improved considerably resulting in a face board structure of high quality and high reliability.