PURPOSE: To easily manufacture a flexible circuit board in which no warpage occurs and which has a large area by forming a conductor circuit having no stress on a glass or ceramic board by printing, baking, and transferring it to the board having viscosity.

CONSTITUTION: Paste ink for forming a conductor is offset-printed on a glass board 1 by using a waterless lithographic offset printer, and baked to form a conductor circuit 2. Then, the circuit 2 is transferred to a flexible table 3 having an adhesive surface to obtain a flexible board 4. Since the board 4, the circuit 2 do not have a stress, no warpage occurs. Further, the board having large area can be easily formed.