To provide a manufacturing method of an IC card for forming a recessed part for loading an IC module on a heat resistant card base smoothly and with high accuracy.

A process for manufacturing the card base with a surface sheet on which a loading position of an IC module is indicated, a process for punching the outer contour shape of the IC module on the surface of the card base by pressing a cutting die 21 on the IC module loading part, a process for removing the surface sheet by cutting the inside of the punched outer counter shape by a cutting tool 31 and for cutting the IC module to depth in which the IC module is loaded, a process for applying or temporarily placing adhesive agent on the IC module loading part and a process for fixing the IC module on the card base by applying heat pressure after loading the IC module on the adhesive agent are included in the manufacturing method of the IC card for loading the IC module by cutting and forming the recessed part 18 for loading the IC module on the heat resistant card base, a process for manufacturing the card base with a surface sheet to indicate a position of an IC module loading part.