Title:
MANUFACTURE OF HEAT SLINGER FOR SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP3886626
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a method for manufacturing heat slinger for semiconductor device, by which a flat surface formed on the projecting section of a metallic plate obtained by press working, etc., can be flattened to such a degree that a semiconductor element, etc., can be mounted on the surface.
SOLUTION: After a projecting section 12 is protruded from one surface of a belt-like metallic plate 10 by forming a recessed section 18 on the other surface of the plate 10 by press working, the plate 10 is held between a first spacer 20 having a recessed section 26 formed correspondingly to the projecting section 12 of the plate 10 and a second spacer 22 having a projecting section 30 formed correspondingly to the recessed section 18 of the plate 10, and the upper surface 12a of the projecting section 12 of the plate 10 is flattened by heat-treating the plate 10 while the plate 10 is pressed.
Inventors:
Shoizumi Koizumi
Shunichi Umemoto
Shunichi Umemoto
Application Number:
JP35108497A
Publication Date:
February 28, 2007
Filing Date:
December 19, 1997
Export Citation:
Assignee:
Shinko Electric Industry Co., Ltd.
KABUSHIKI KAISHA KOBE SEIKO SHO
KABUSHIKI KAISHA KOBE SEIKO SHO
International Classes:
B21D1/00; H01L23/36; B21J5/02; B21K23/00; (IPC1-7): H01L23/36; B21D1/00; B21J5/02; B21K23/00
Domestic Patent References:
| JP62118920A | ||||
| JP5267511A | ||||
| JP6047443A | ||||
| JP8250630A | ||||
| JP9066336A | ||||
| JP9111312A |
Attorney, Agent or Firm:
Takao Watanuki
Horimai Kazuharu
Horimai Kazuharu
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