PURPOSE: To securely joint between a spiral member and a dielectric support by forming metal films on the surface of a dielectric support and a spiral member then after heating and jointing them through an alloy layer removing said metal film.

CONSTITUTION: A molybdenum film 5 and a copper layer 6 are formed at the portion on the surface of a dielectric support 2 containing 95% of beryllia contacting with a spiral portion. While a metal layer 7 is provided on the surface of the spiral member 3 made of molybdenum. Then said support 2 and the spiral member 3 are contacted and heated to adher them. An alloy layer 8 is formed through said thermal adhesion. Thereafter corrosion liquid is employed to remove the metal layer 7 on the surface of the spiral member. Then the copper layer 6 and the molybdenum film 5 on the surface of the dielectric member 2 are removed by the corrosion liquid to produce a helix type delay wave circuit having a spiral-dielectric member joint structure.