PURPOSE: To simultaneously eliminate the surface of a thin film conductor pattern and an attachced substance and to facilitate the corrosion processing by using a double layer resist structure whose lower layer has a quality soluble in a weak acidic or weak alkaline water solution.
CONSTITUTION: A photoresist pattern formed on a thin film conductor 2 is constituted of a double layer resist structure consisting of a first photosensitive resin layer 4 and a second resin layer 3. A second resin layer 3 being its lower layer has a quality soluble for a weak acidic or weak alkaline water solution. After executing dry etching by utilizing this quality, a substrate 1 is immersed into the weak acidic or weak alkaline water solution, a second resin layer 3 is solved, by which a first photosensitive resin layer 4 is peeled off simultaneously together with a second resin layer 3, and a resist can be eliminated. Also, since a second resin layer being the lower layer is solved, an attachment formed on the side face of the photoresist pattern can also be eliminated easily, and the high frequency band surface acoustic wave element having high reliability can be manufactured with high accuracy.
IMURA AKIRA
SHIBAGAKI NOBUHIKO
HOSHINA YOSHINORI
ISOBE ATSUSHI
HIKITA MITSUTAKA
SUZUKI MAKOTO
| JPS60134537U | 1985-09-07 | |||
| JPS6254613A | 1987-03-10 |