Title:
MANUFACTURE OF HIGHLY RIGID COPPER-CLAD LAMINATED PLATE
Document Type and Number:
Japanese Patent JP3452674
Kind Code:
B2
Abstract:
PURPOSE: To obtain a highly rigid copper-clad laminated plate having excellent electrolytic corrosion resistance and adhesion to a copper foil.
CONSTITUTION: One or a plurality of prepregs, obtained by impregnating a thermosetting resin composition having 20-60vol.% of filler with a glass cloth and drying them, are layered. At least on its one face, at a face in contact with the prepreg, a copper foil having an adhesive layer having a thickness of 1-5μm is superposed and integrally molded by heat pressure so as to obtain a copper-clad laminated plate.
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Inventors:
Norio Okano
Kazuhito Kobayashi
Shoshi Nakaso
Kazuhito Kobayashi
Shoshi Nakaso
Application Number:
JP2178795A
Publication Date:
September 29, 2003
Filing Date:
February 09, 1995
Export Citation:
Assignee:
Hitachi Chemical Co., Ltd.
International Classes:
B32B15/08; B32B17/04; H05K1/03; H05K3/00; (IPC1-7): B32B15/08; H05K3/00
Domestic Patent References:
| JP61270151A | ||||
| JP57197892A | ||||
| JP5640296A | ||||
| JP5309789A |
Attorney, Agent or Firm:
Hidekazu Miyoshi
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