Title:
MANUFACTURE OF HOLDING DEVICE FOR SEMICONDUCTOR DISC AND HOLDING DEVICE MANUFACTURED BY THE SAME
Document Type and Number:
Japanese Patent JP3223183
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To ensure requirements for cleanliness in relation to a material to be used for parts of a device and a material to be used for part connections of the device and ensure mechanical stability of part connections up to a temperature of 1,350°C in a method for manufacturing a holding device, in which a plurality of parts of the device are assembled and connected with each other to form a holding device for a semiconductor disc.
SOLUTION: A plurality of parts 7 and 8 are manufactured individually from a single crystal or polycrystalline silicon, and fitting surfaces 9 and 10 corresponding each other are provided to the respective parts 7 and 8. The parts adjacent to each other in a holding device are jointed to each other by means of facing surfaces, and finally, the parts are connected with each other on the fitting surfaces 9 and 10, by at least either soldering using a germanium powder as a solder or diffusion welding.
Inventors:
Peter jochmann
Walter nut rack
Klaus Jiffeck
Edit Zimmermann
Walter nut rack
Klaus Jiffeck
Edit Zimmermann
Application Number:
JP32961299A
Publication Date:
October 29, 2001
Filing Date:
November 19, 1999
Export Citation:
Assignee:
Zico Jena Game Behr Quartz Schmelze
International Classes:
H01L21/67; B23K35/28; H01L21/673; H01L21/68; B23K35/00; B23K35/02; (IPC1-7): H01L21/68
Domestic Patent References:
| JP5362481A | ||||
| JP9172204A | ||||
| JP10284428A |
Attorney, Agent or Firm:
Hironobu Onda (1 person outside)