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Title:
MANUFACTURE OF IC CARD
Document Type and Number:
Japanese Patent JP3212025
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To provide a method for manufacture an IC card having an excellent productivity, smooth card surfaces and excellent workability.
SOLUTION: An IC card comprises a circuit formed on a plastic film 1 using a conductive ink, a printed circuit on which an electric part 4 is equipped, a spacer layer comprising in turn a film with an adhesive which is cut for a portion for the electric part, and a plurality of layers of films with an adhesive. The IC card is produced using a manufacturing method in which while aligning the positions of the base materials with each other, they are continuously laminated at a lamination temperature higher than the glass transition temperature of the plastic film 1.


Inventors:
Masakatsu Suzuki
Koji Himori
Application Number:
JP14181397A
Publication Date:
September 25, 2001
Filing Date:
May 30, 1997
Export Citation:
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Assignee:
Hitachi Chemical Co., Ltd.
International Classes:
B42D15/10; G06K19/07; G06K19/077; H01L21/56; (IPC1-7): G06K19/077; G06K19/07
Domestic Patent References:
JP8216573A
JP91969A
JP9286189A
JP9323490A
Attorney, Agent or Firm:
Hidekazu Miyoshi (1 outside)



 
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