Title:
MANUFACTURE OF INSULATING RESIN MOLDING AND DEVICE THEREFOR
Document Type and Number:
Japanese Patent JP3590077
Kind Code:
B2
Abstract:
PURPOSE: To manufacture an insulating resin molding whose field/stress concentrated portion has its electrical and mechanical characteristics improved by pouring an insulating resin casting material of different filler mixing ratios into plural divisions of a metal mold, and curing the material after removal of the divisions.
CONSTITUTION: A metal mold 5 is partitioned into plural divisions by partition plates 4. An insulating resin casting material 2, retained in a heat-resisting container 3 and comprising a curing agent and a filler 1 mixed in a main agent, is poured into each of the divisions. In that case, the insulating resin casting material 2 differs in the mixing ratio of filler 1, and when necessary this mixing ratio is controlled continuously or plural different kinds of filler are employed. After the casting material 2 is poured, the divisions are eliminated by removal of the partition plates 4 and the resin is cured and molded. The boundaries among the divisions are therefore eliminated and the divisions are integrated together, and also, desired amounts of filler are put in each portion, whereby an insulating resin molding which can exhibit characteristics corresponding to service conditions which vary with its portions is obtained.
Inventors:
Toshio Shimizu
Kenichi Sato
Susumu Kinoshita
Masaru Miyakawa
Yasufumi Nagata
Kenichi Sato
Susumu Kinoshita
Masaru Miyakawa
Yasufumi Nagata
Application Number:
JP22657692A
Publication Date:
November 17, 2004
Filing Date:
August 26, 1992
Export Citation:
Assignee:
Toshiba Corporation
International Classes:
H01B3/30; H01B17/26; H01B19/00; (IPC1-7): H01B19/00; H01B3/30; H01B17/26
Domestic Patent References:
| JP544958A | ||||
| JP5991046A | ||||
| JP62180505U |
Attorney, Agent or Firm:
Hideaki Togawa