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Patent Searching and Data


Title:
MANUFACTURE OF INSULATIVE TAPE FOR FLAT CABLE
Document Type and Number:
Japanese Patent JP3288069
Kind Code:
B2
Abstract:

PURPOSE: To enhance adhesivity with a conductor, flame retardancy, and heat resistance and enable manufacturing at a lower cost, by forming an adhesive resin layer by means of an extrusion molding method and laminating it on a base member.
CONSTITUTION: In a manufacturing method of an insulative tape for a flat cable containing a base member and an adhesive resin layer adhering to a conductor, the adhesive resin layer is formed by extrusion molding method and is laminated on the base member. For the base member generally used PET, PVC, polycarbonate, a laminated body of PET with PVC, a laminated body of PET with PC, ethylene acrylate copolymer, or the like can be listed. The resin formed by the extrusion molding method for the adhesive resin layer is not specially restricted, and, for example, saturated copolymerized polyester, urethan, olefine, epoxy, silicone, or blend between them, can be used.


Inventors:
Shuji Kitahara
Application Number:
JP13694992A
Publication Date:
June 04, 2002
Filing Date:
May 28, 1992
Export Citation:
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Assignee:
RIKEN TECHNOS CO., LTD.
International Classes:
B29C47/02; B32B27/00; H01B7/08; H01B13/14; H01B17/56; H01B19/00; (IPC1-7): H01B13/14; B29C47/02; B32B27/00; H01B17/56; H01B19/00
Domestic Patent References:
JP62167383A
JP1113916U
Attorney, Agent or Firm:
Soga Doteru (6 people outside)