PURPOSE: To make the manufacture of hybrid IC at small quantity economical in terms of equipment and productivity by a method wherein the leads of DIP type IC are cut into DIP type while the leads of SIP type IC are cut into SIP type after removing unnecessary lead group out of one side of exterior package.

CONSTITUTION: In order to manufacture two types of IC i.e. DIP type and SIP type, they are manufactured until the process preceding the process of cutting leads utilizing a common lead frame 1 formed into the arrangement shape wherein inner ends of outer leads are concentrated at both ends of a land to fix IC main body thereto. Later DIP type is manufactured by cutting leads excluding the leads A, B at both ends of an exterior package 10 while SIP type is manufactured by cutting leads after removing unnecessary lead B at one side of another exterior package 10'. Through these procedures, the cost of manufacturing IC may be reduced since the IC of DIP and SIP types may be manufactured in almost the same procedures utilizing the same production equipments excluding those for the process of cutting leads reducing the lad frame manufacturing cost due to the lead frames formed into common type.